Prelaminated inlay Combi
Prelaminated inlay Combi are designed specifically with the card manufacturer in mind.
RFID inlay Combi consist of two or even more different chip technologies, offering combinations of HF + LF, HF + UHF or LF + UHF chips in one card. Even a contact chip module can be embedded if the layout is designed accordingly.

Product Description

Prelaminated rfid inlays are suitable for use in the production of ISO standard cards. RFIDHY uses a proprietary manufacturing process to produce its prelaminated rfid inlays.

Our rfid inlays are very robust and boast unequaled torsion / bending characteristics, extreme durability and optimized read / write performance. The inlays have a completely flat finish and bring numerous benefits to card manufacturers.

Our rfid inlay is essentially a semi-finished product, so that the card manufacturer merely needs to collate his printed sheets with the inlay and laminate the “sandwich”.

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  • Very reliable and robust plastic package
  • High reading distance optimized to each chip
  • Materials: PVC, PETG, PC
  • Colour: white or transparent
  • Option of combining two different chip technologies in one prelam
  • Different sheet formats are available 1 × 5, 2 × 5, 3 × 6, 3 × 7, 3 × 8, 3 × 10, 4 × 10 up to 640 × 520 mm, others upon request
  • Thickness: LF+HF(0.6mm), LF+UHF(0.55~0.6mm), HF+UHF(0.5mm)

Features Examples of application

    • Physical access
    • Logical access
    • Public transport
    • City card
    • Student card
    • E-purse systems

Available chip technologies

Manufacturer/Frequency 125 kHz 13.56 MHz 860-960Mhz
EM Microelectronic EM4102, EM4200, EM4305, EM4450
NXP Hitag®1, 2, S MIFARE Ultralight®, MIFARE® Classic, MIFARE® DESFire®, MIFARE Plus®, I-Code®: SLI
Infineon MIFARE®: SLE66R35
Atmel ATA5575M1, ATA5575M2, ATA5577, Q5
Legic® Prime: MIM256, MIM1024
Impinj Monza 4, Monza 5
Alien Alien H3, H4

Other ICs are available upon request.

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